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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/22 tsz22111 ? 14? 001 ? 2013 rohm co., ltd. all rights reserved. tsz02201-0r2r0g100510-1-2 25.feb.2013 rev.002 www.rohm.com serial eeprom series standard eeprom wlcsp eeprom brca016gwz-w (16kbit) general description brca016gwz-w series is a serial eeprom of i 2 c bus interface method. features completely conforming to the world standard i 2 c bus. all controls available by 2 ports of serial clock (scl) and serial data (sda) other devices than eeprom can be connected to the same port, saving microcontroller port. 1.7v to 3.6v single power source operation most suitable for battery use. possible fast mode 400khz operation page write mode useful for initial value write at factory shipment. self-timed programming cycle low current consumption ? at write operation (5v) : 0.5ma (typ) ? at read operation (5v) : 0.2ma (typ) ? at standby operation (5v) : 0.1 a (typ) prevention of write mistake ? write (write protect) function added ? prevention of write mistake at low voltage ucsp30l1 compact package ? w(typ) x d(typ) x h(max) :1.30mm x 0.77mm x 0.35mm more than 1 million write cycles more than 40 years data retention noise filter built in scl / sda terminal initial delivery state ffh brca016gwz-w capacity bit format type power source voltage package 16kbit 2k8 brca016gwz-w 1.7v to 3.6v ucsp30l1 ? absolute maximum ratings (ta=25c) parameter symbol limit unit remark supply voltage v cc -0.3 to +6.5 v permissible dissipation pd 220 mw derate by 2.2mw/c when operating above ta=25c storage temperature tstg -65 to +125 c operating temperature topr -40 to +85 c input voltage/ output voltage - -0.3 to vcc+1.0 v ? memory cell characteristics (ta=25c, vcc=1.7v to 3.6v) parameter limit unit min typ max write cycles (1) 100,000 - - times data retention (1) 40 - - years (1) not 100% tested
2/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 recommended operating ratings parameter symbol limit unit power source voltage vcc 1.7 to 3.6 v input voltage v in 0 to vcc dc characteristics (unless otherwise specified, ta=-40 c to +85c, vcc=1.7v to 3.6v) parameter symbol limit unit conditions min typ max input high voltage1 v ih1 0.7vcc - vcc+1.0 v input low voltage1 v il1 -0.3 - +0.3vcc v output low voltage1 v ol1 - - 0.4 v i ol =3.0ma , 2.5v QvccQ3.6v (sda) output low voltage2 v ol2 - - 0.2 v i ol =0.7ma , 1.7v QvccQ2.5v (sda) input leakage current i li -1 - +1 a v in =0 to vcc output leakage current i lo -1 - +1 a v out =0 to vcc (sda) supply current (write) i cc1 - - 2.0 ma vcc=3.6v , f scl =400khz, t wr =5ms byte write, page write supply current (read) i cc2 - - 0.5 ma vcc=3.6v , f scl =400khz random read, current read, sequential read standby current i sb - - 2.0 a vcc=3.6v , sda ?scl=vcc a0, a1, a2=gnd, wp=gnd ac characteristics (unless otherwise specified, ta=-40 c to +85c, vcc=1.7v to 3.6v) parameter symbol limit unit min typ max clock frequency f scl - - 400 khz data clock high period t high 0.6 - - s data clock low period t low 1.2 - - s sda, scl rise time (1) t r - - 0.3 s sda, scl fall time (1) t f - - 0.3 s start condition hold time t hd:sta 0.6 - - s start condition setup time t su:sta 0.6 - - s input data hold time t hd:dat 0 - - ns input data setup time t su:dat 100 - - ns output data delay time t pd 0.1 - 0.9 s output data hold time t dh 0.1 - - s stop condition setup time t su:sto 0.6 - - s bus free time t buf 1.2 - - s write cycle time t wr - - 5 ms noise spike width(sda,scl terminal) t i - - 0.1 s wp hold time t hd:wp 1.0 - - s wp setup time t su:wp 0.1 - - s wp high period t high:wp 1.0 - - s (1) not 100% tested
3/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 sda scl d0 ack stop condition start condition t wr write data(n) serial input / output timing sda tsu:sta tsu:sto thd:sta start bit stop bit scl figure 1-(b). start - stop bit timing figure 1-(c). write cycle timing figure 1-(d). wp timing at write execution figure 1-(e). wp timing at write cancel thigh:wp wp sda d1 d0 ack ack data(1) data(n) twr scl at write execution, in the area from the d0 taken clock rise of the first data(1), to t wr , set wp= 'low'. by setting wp "high" in the area, write can be cancelled. when it is set wp = 'high' during t wr , write is forcibly ended, and data o f address under access is not guaranteed, therefore write it once again. sda () sda () thd:sta thd:dat tsu:dat tbuf tpd tdh tlow thigh tr tf scl (input) (output) scl sda wp hd wp ???? wr d1 d0 a ck a ck data(1) data(n) tsu wp stop condition input read at the rise edge of scl data output in sync with the fall of scl figure 1-(a). serial input / output timing
4/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 block diagram pin configuration (bottom view) pin descriptions land no. pin name i/o descriptions b3 test input test terminal, connect to gnd b2 gnd - ground (0v) b1 sda input, output slave word address serial data input serial data output a3 vcc - power supply a2 wp input write protect a1 scl input serial clock input 3 b a 1 2 a1 a2 b1 b2 a3 b3 sda gnd test vcc wp scl sda scl wp 16k array address decoder slave, word address register data register contorol logic high volt gen vcc level detect 11bit 11bit 8bit ack start stop v gnd test vcc
5/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 output low voltage1: v ol1 (v) output low current: i ol (ma) typical performance curves figure 2. input high voltage1 vs supply voltage (scl,sda,wp) figure 4. output low voltage1 vs output low current (v cc =2.5v) figure 5. output low voltage2 vs output low current (v cc =1.7v) input high voltage1: v ih 1 (v) supply voltage : v cc (v) output low voltage2: v ol2 (v) output low current: i ol (ma) figure 3. input low voltage1 vs supply voltage (scl,sda,wp) input low voltage1: v il1 (v) supply voltage : v cc (v)
6/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 typical performance curves ? continued figure 8. supply current (write) vs supply voltage (f scl =400khz) supply current (write): i cc 1 (ma) supply voltage : v cc (v) figure 9. supply current (read) vs supply voltage (f scl =400khz) supply current (read): i cc 2 (ma) supply voltage : v cc (v) figure 7. output leakage current vs supply voltage (sda) figure 6. input leakage current vs supply voltage (scl, wp) input leakage current: i li (a) supply voltage : v cc (v) output leakage current: i lo (a) supply voltage : v cc (v)
7/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 typical performance curves ? continued figure 12. data clock high period vs supply voltage figure 10. standby current vs supply voltage supply voltage : v cc (v) standby current: i sb (a) figure 11. clock frequency vs supply voltage supply voltage : v cc (v) clock frequency: f scl (khz) supply voltage : v cc (v) data clock high period: t high (a) figure 13. data clock low period vs supply voltage ta = 8 5 supply voltage : v cc (v) data clock low period: t low (s)
8/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 typical performance curves ? continued figure 14. start condition hold time vs supply voltage supply voltage : v cc (v) start condition hold time: t hd:sta (s) figure 15. start condition setup time vs supply voltage supply voltage : v cc (v) start condition setup time: t su:sta (a) figure 16. input data hold time vs supply voltage supply voltage : v cc (v) input data hold time: t hd:dat (ns) figure 17. input data setup time vs supply voltage supply voltage : v cc (v) input data setup time: t su:dat (ns)
9/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 typical performance curves ? continued figure 18. output data delay time vs supply voltage (low) supply voltage : v cc (v) output data delay time: t pd (s) figure 19. output data delay time vs supply voltage (high) supply voltage : v cc (v) output data delay time: t pd (s) figure 20. bus free time vs supply voltage ta = 8 5 supply voltage : v cc (v) bus free time: t buf (s) figure 21. write cycle time vs supply voltage ta = 8 5 supply voltage : v cc (v) write cycle time: t wr (ms)
10/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 typical performance curves ? continued figure 22. noise spike width vs supply voltage (scl high) effective supply voltage : v cc (v) noise spike width (scl h igh ) : t l ( s ) figure 23. noise spike width vs supply voltage (sda high) effective supply voltage : v cc (v) noise s p ike width ( sda high ) : t l ( s ) figure 24. wp setup time vs supply voltage supply voltage : v cc (v) wp setu p time: t su :wp ( s ) figure 25. wp high period vs supply voltage supply voltage : v cc (v) wp high period: t high:wp (s)
11/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 timing chart 1. i 2 c bus data communication i 2 c bus data communication starts by start condition input, and e nds by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus data communication with several devices is possible by connecting with 2 communication lines: serial data (sda) and serial clock (scl). among the devices, there should be a ?ma ster? that generates clock and control communication start and end. the rest become ?slave? which are controlled by an address peculiar to each device, like this eepro m. the device that outputs data to the bus during data communication is called ?transmitter?, and the device that receives data is called ?receiver?. 2. start condition (start bit recognition) (1) before executing each command, start condition (start bit) where sda goes from 'high' down to 'low' when scl is 'high' is necessary. (2) this ic always detects whether sda and scl are in start co ndition (start bit) or not, therefore, unless this condition is satisfied, any command cannot be executed. 3. stop condition (stop bit recognition) (1) each command can be ended by a stop condition (stop bit) where sda goes from 'low' to 'high' while scl is 'high' 4. acknowledge (ack) signal (1) the acknowledge (ack) signal is a software rule to show whether data transfer has been made normally or not. in a master-slave communication, the device (ex. -com s ends slave address input for write or read command, to this ic ) at the transmitter (sending) side re leases the bus after output of 8bit data. (2) the device (ex. this ic receives the slave address i nput for write or read command from the -com) at the receiver (receiving) side sets sda 'low' during the 9th clock cycle, and outputs acknowledge signal (ack signal) showing that it has received the 8bit data. (3) this ic, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ack signal) 'low'. (4) after receiving 8bit data (word address and write data) during each write operation, th is ic outputs acknowledge signal (ack signal) 'low'.. (5) during read operation, this ic outputs 8bit data (read data) and detects a cknowledge signal (ack signal) 'low'. when acknowledge signal (ack signal) is detected, and st op condition is not sent from the master (-com) side, this ic continues to output data. when acknowledge signal (ack signal) is not detected, this ic stops data transfer, recognizes stop condition (stop bi t), and ends read operation. then th is ic becomes ready for another transmission. 5. device addressing (1) slave address comes after start condition from master. (2) the significant 4 bits of slave address are used for recognizing a device type. the device code of this ic is fixed to '1010'. (3) next slave addresses (p2 p1 p0) are upper 3bit of wo rd address, put these and word address ( wa0 to wa7 ) together, 11bit word address ( 2048by te ) of the device specified. (4) the most insignificant bit ( w/r --- read / write) of slave address is used for designating write or read operation, and is as shown below. setting w/r to 0 ------- write (setting 0 to word address setting of random read) setting w/r to 1 ------- read type slave address maximum number of connected buses brca016gwz-w 1 0 1 0 p2 p1 p0 w/r 1 p0 to p2 are page select bits (upper 3bit of word address). figure 26. data transfer timing 89 89 89 s p condition condition ack stop ack data data addres s start r/w ack 1-7 sda scl 1-7 1-7
12/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 write command 1. write cycle (1) arbitrary data can be written to this eeprom. when writ ing only 1 byte, byte write is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. the maximum number of bytes is specified per device of each ca pacity. up to 16 arbitrary bytes can be written. (2) data is written to the address designated by word address (n-th address) (3) by issuing stop bit after 8bit data input, internal write to memory cell starts. (4) when internal write is started, command is not accepted for t wr (5ms at maximum). (5) using page write cycle, writing in bulk is done as follows : when data of more than 16bytes is sent, the byte in excess overwrites the data already sent first. (ref er to "internal address increment" in page 13.) figure 27. byte write cycle figure 28. page write cycle p1 p2 wa 7 d7 1 1 0 0 w r i t e s t a r t r / w s t o p word address data slave address p0 wa 0 d0 a c k sda line a c k a c k w r i t e s t a r t r / w a c k s t o p word address(n) data(n) sda line a c k a c k data(n+15) a c k slave address 1 0 0 1a0 a1 a2 wa 7 d0 d7 d0 ? ) wa 0 p2p1p0
13/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 2. notes on write cycle continuous input 3. notes on page write cycle list of numbers of page write number of pages 16byte product number brca016gwz-w the above numbers are maximum bytes for respective types. any bytes below these can be written. in the case brca016gwz-w, 1 page=16bytes, but the page write cycle write time is 5ms at maximum for 16byte bulk write. it does not stand 5ms at maximum 16byte=80ms (max) 4. internal address increment page write mode 5. write protect (wp) terminal write protect (wp) function when wp terminal is set at vcc (h level), data rewrite of all addr esses is prohibited. when it is set at gnd (l level), data rewrite of all address is enabled. be sure to connect this terminal to vcc or gnd, or control it to h level or l level. do not leave it open. at extremely low voltage at power on / off, by setting the wp terminal 'h', write error can be prevented. wa7 ----- wa4 wa3 wa2 wa1 wa0 0 ----- 0 0 0 0 0 0 ----- 0 0 0 0 1 0 ----- 0 0 0 1 0 0 ----- 0 1 1 1 0 0 ----- 0 1 1 1 1 0 ----- 0 0 0 0 0 --------- --------- 0eh significant bit is fixed. no digit up increment for example, when it is started from address 0eh, then, increment is made as below, 0eh 0fh 00h 01h ---, please take note. * 0eh ??? 0e in hexadecimal, therefore, 00001110 becomes a binary number. w r i t e s t a r t r / w a c k s t o p word address ? data (n) sda line a c k data (n+15) a c k slave address 1 0 0 1 p0 p1p2 wa 7 d0 d7 d0 a c k wa 0 1 1 0 0 next command t wr (maximum : 5ms) command is not accepted for this period. a t sp (stop bit), write starts. s t a r t figure 29. page write cycle
14/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 read command 1. read cycle read cycle is when data of eeprom is read. read cycle coul d be random read cycle or current read cycle. random read cycle is a command to read data by designating a specif ic address, and is used generally. current read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycle is available where the next address data can be read in succession. (1) in random read cycle, data of designated word address can be read. (2) when the command just before current read cycle is r andom read cycle, current read cycle (each including sequential read cycle), data of incremented last read addr ess (n)-th, i.e., data of the (n+1)-th address is output. (3) when ack signal 'low' after d0 is detected, and stop condition is not sent from master ( -com) side, the next address data can be read in succession. (4) read cycle is ended by stop condition where 'h' is input to ack signal after d0 and sda signal goes from ?l? to ?h? while scl signal is 'h' . (5) when 'h' is not input to ack signal after d0, sequential read gets in, and the next data is output. therefore, read command cycle cannot be ended. to end the read command cycle, be sure to input 'h' to ack signal after d0, and the stop condition where sda goes from ?l? to ?h? while scl signal is 'h'. (6) sequential read is ended by stop condition where 'h' is input to ack signal after arbitrary d0 and sda is asserted from ?l? to ?h? while scl signal is 'h'. figure 30. random read cycle figure 31. current read cycle figure 32. sequential read cycle (in the case of current read cycle) it is necessary to input 'h' to the last ack. it is necessary to input 'h' to the last ack. s t a r t s t o p sda line a c k data(n) a c k slave address 10 0 1 p0 p1 p2 d0 d7 r / w r e a d w r i t e s t a r t r / w a c k s t o p word address(n) sda line a c k a c k data(n) a c k slave address 10 0 1 p0 p1 p2 wa 7 a0 d0 slave address 10 0 1a1 a2 s t a r t d7 r / w r e a d wa 0 *1 r e a d s t a r t r / w a c k s t o p data(n) sda line a c k a c k data(n+x) a c k slave address 10 0 1 p0 p1 p2 d0 d7 d0 d7
15/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 software reset software reset is executed to avoid malfunction after po wer on and during command input. software reset has several kinds and 3 kinds of them are shown in the figure below. (ref er to figure 33(a), figure 33(b), and figure 33(c).) within the dummy clock input area, the sda bus is released ('h' by pu ll up) and ack output and read data '0' (both 'l' level) may be output from eeprom. therefore, if 'h' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. acknowledge polling during internal write execution, all in put commands are ignored, therefore ack is not returned. during internal automatic write execution after write cycle input, next command (slave addr ess) is sent. if the first ack signal sends back 'l', then it means end of write operation, else 'h' is returned, which m eans writing is still in progress. by the use of acknowledge polling, next command can be executed without waiting for t wr = 5ms. to write continuously, w/r = 0, then to carry out current read cycle after write, slave address with w/r = 1 is sent. if ack signal sends back 'l', and then execute word address input and data output and so forth. 1 2 13 14 scl dummy clock14 start2 figure 33-(a) the case of 14 dummy clock +start+start+ command input start command from start input. 2 1 8 9 dummy clock9 start figure 33-(b) the case of start +9 dummy clocks +start+ command input start normal command normal command normal command normal command start9 1 2 3 8 9 7 figure 33-(c) start9+ command input normal command normal command slave address word address s t a r t first write command a c k h a c k l slave address slave address slave address data write command during internal write, ack = high is returned. after completion of internal write, ack=low is sent back, so input next word address and data in succession. t wr t wr second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l figure 34. case of continuous write by acknowledge polling scl sda scl sda sda
16/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 wp valid timing (write cancel) wp is usually fixed to 'h' or 'l', but when wp is used to canc el write cycle and so forth, pay attention to the following wp valid timing. during write cycle execution, in cancel valid area, by setting wp='h', write cycle can be cancelled. in both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in d0 of data(in page write cycle, the first byte data) is cancel invali d area. wp input in this area becomes don't care. set the setup time to rise of d0 taken scl 100ns or more. the area from the ri se of scl to take in d0 to input the stop condition is cancel valid area. and, after execution of forced end by wp, standby status gets in. command cancel by start condition and stop condition during command input, by continuously inputting start condi tion and stop condition, command can be cancelled. (figure 36) however, within ack output area and during data read, sda bus may output 'l'. in this case, start condition and stop condition cannot be input, so reset is not available. theref ore, execute software reset. when command is cancelled by start-stop condition during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined. therefore, it is not possible to carry out current read cycle in succession. to carry out read cycle in succession, carry out random read cycle. figure 35. wp valid timing figure 36. case of cancel by start, stop condition during slave address input scl sda 1 1 0 0 start condition stop condition ? rise of d0 taken clock scl d0 ack enlarged view scl sda ack d0 ? rise of sda sda wp wp cancel invalid area wp cancel valid area data is not written. slave address d7 d6 d5 d4 d3 d2 d1 d0 data t wr sda d1 s t a r t a c k l a c k l a c k l a c k l s t o p word address enlarged view wp cancel invalid area
17/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 i/o peripheral circuit 1. pull up resistance of sda terminal sda is nmos open drain, so it requires a pu ll up resistor. as for this resistance value (r pu ), select an appropriate value from microcontroller v il , i l , and v ol -i ol characteristics of this ic. if r pu is large, operating frequenc y is limited. the smaller the r pu , the larger is the supply current (read). 2. maximum value of r pu the maximum value of r pu is determined by the following factors. (1)sda rise time to be determined by the capacitance (c bus ) of bus line of r pu and sda should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is slow. (2)the bus? electric potential a to be dete rmined by the input current leak total (i l ) of the device connected to the bus with output of 'h' to the sda line and r pu should sufficiently secu re the input 'h' level (v ih ) of microcontroller and eeprom including recommended noise margin of 0.2vcc. 3. minimum value of r pu the minimum value of r pu is determined by the following factors. (1)when ic outputs low, it should be satisfied that v olmax =0.4v and i olmax =3ma. (2)v olmax =0.4v should secure the input 'l' level (v il ) of microcontroller and eeprom including the recommended noise margin 0.1 of vcc. v olmax Q v il -0.1 v cc ex.) when v cc =3v, v ol =0.4v, i ol =3ma, microcontroller, eeprom v il =0.3vcc from (1) therefore, the condition (2) is satisfied. 4. pull-up resistance of scl terminal when scl control is made at the cmos output port, there is no need for a pull up resistor. but when there is a time where scl becomes 'hi-z', add a pull up resistor. as for the pull up resistor value, one of several k to several ten k is recommended in consideration of drive per formance of output port of microcontroller. 5. process of wp terminal wp terminal is the terminal that prohibits and permits write in hardware manner. in 'h' status, only read is available and write of all address is prohibited. in ca se of 'l', both are available. if using as an rom, it is recommended to connect it to pull up or vcc. if using both read and write, cont rol wp terminal or connect it to pull down or gnd. r pu R 3 0.4 3 10 -3 R 867 [ ] and v ol = 0.4 [v] v il = 0.3 3 = 0.9 [v] r pu Q ex. ) when v cc =3v, i l =10 a, v ih =0.7 v cc , from (2) 0.8 3 0.7 3 10 10 -6 r pu Q Q 300 [k ] 0.8vcc v ih i l v cc - i l r pu 0.2vcc R v ih v cc v ol i ol v cc v ol r pu Q i ol r pu R microcontroller bus line capacity c bus figure 37. i/o circuit diagram r pu a brca016gwz-w sda terminal i l i l
18/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 cautions on microcontroller connection 1. r s in i 2 c bus, it is recommended that sda port is of open drain input/output. however, when us ing cmos input / output of tri state to sda port, insert a series resistance r s between the pull up resistor r pu and the sda terminal of eeprom. this is to control over current that may occur when pm os of the microcontroller and nmos of eeprom are turned on simultaneously. r s also plays the role of protection the sda terminal against surge. therefore, even when sda port is open drain input/output, r s can be used. 2. maximum value of r s the maximum value of r s is determined by the following relations: (1)sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is slow. (2)the bus electric potential a to be determined by r pu and r s the moment when eeprom outputs 'l' to sda bus should sufficiently secure the input 'l' level (v il ) of microcontroller including recommended noise margin of 0.1vcc. 3. minimum value of r s the minimum value of r s is determined by over current at bus collision. when over current flows, noises in power source line and instantaneous power failure of power source may o ccur. when allowable over current is defined as i, the following relation must be satisfied. determine the allowable current in consideration of t he impedance of power source line in set and so forth. set the over current to eeprom at 10ma or lower. microcontroller eeprom 'l' output r s r pu 'h' output over current figure 40. i/o circuit diagram v cc r s v cc i R 1010 -3 Q i r s R 300[ ? ] example when v cc =3v, i=10ma r s R 3 example when v cc =3v, v il =0.3v cc, v ol =0.4v, r pu =20k , Q fro m (2 ), r pu v il v ol 0.1v cc 1.1v cc v il 1.13 0.33 0.33 0.4 0.13 r s Q 2010 3 1.67 [k ?] r pu +r s (v cc v ol )r s +v ol +0.1v cc Q v il r s Q r pu microcontroller r s eeprom figure 38. i/o circuit diagram figure 39. input / output collision timing a ck 'l' output of eeprom 'h' output of microcontroller over current flows to sda line by 'h' output of microcontroller and 'l' output of eeprom. scl sda r pu microcontroller r s eeprom i ol a bus line capacity cbus v ol v cc v il figure 41. i/o circuit diagram
19/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 i/o equivalence circuit 1. input (scl, wp ) 2. input / output (sda) power-up / down conditions at power on, the ic?s internal circuits may go through unstable low voltage area as the vcc rises, making the ic?s internal logic circuit not completely reset, hence, malfunction may occur. to prevent this, the ic is equipped with por circuit and lvcc circuit. to assure the operation, obser ve the following conditions at power on. 1. set sda = 'h' and scl ='l' or 'h' 2. start power source so as to satisfy the recommended conditions of t r , t off , and v bot for operating por circuit. 3. set sda and scl so as not to become 'hi-z'. when the above conditions 1 and 2 cannot be obs erved, take the following countermeasures. (1) in the case when the above condition 1 cannot be observed such that sda becomes 'l' at power on. control scl and sda as shown below, to make scl and sda, 'h' and 'h'. (2) in the case when the above condition 2 cannot be observed. after power source becomes stable, execute software reset(page 15). (3) in the case when the above conditions 1 and 2 cannot be observed. carry out (1), and then carry out (2). figure 42. input pin circuit diagram figure 43. input / output pin circuit diagram t off t r v bot 0 v cc figure 44. rise waveform diagram t low t su:dat t dh a fter vcc becomes stable scl v cc sda a fter vcc becomes stable t su:dat figure 45. when scl= 'h' and sda= 'l' figure 46. when scl='h' and sda='l' recommended conditions of t r , t off , v bo t t r t off v bot 10ms or below 10ms or longer 0.3v or below 100ms or below 10ms or longer 0.2v or below
20/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 low voltage malfunction prevention function lvcc circuit prevents data rewrite operation at low power and prevents write error. at lvcc voltage (typ =1.2v) or below, data rewrite is prevented. noise countermeasures 1. bypass capacitor when noise or surge gets in the power sour ce line, malfunction may occur, theref ore, it is recommended to connect a bypass capacitor (0.1 f) between the ic?s vcc and gnd pins. connect the ca pacitor as close to the ic as possible. in addition, it is also recommended to attach a bypass capacitor between the board?s vcc and gnd. operational notes 1. described numeric values and data are design represent ative values only and the values are not guaranteed. 2. we believe that the application circuit examples in th is document are recommendable. however, in actual use, confirm characteristics further sufficiently. if changing th e fixed number of external parts is desired, make your decision with sufficient margin in consid eration of static characteristics, transie nt characteristics, and fluctuations of external parts and our lsi. 3. absolute maximum ratings if the absolute maximum ratings such as supply voltage, operating temperature range and so on are exceeded, lsi may be destroyed. do not supply voltage or subject the ic to temperatures exceeding the absolute maximum ratings. in the case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding t he absolute maximum ratings should not be supplied to the lsi. 4. gnd electric potential set the voltage of gnd terminal lowest at any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal. 5. thermal design use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 6. short between pins and mounting errors be careful when mounting the ic on printed circuit boards . the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted to gether. short circuit may be caused by conductive particles caught between the pins. 7. operating the ic in the presence of strong electromagnetic field may cause malfunction, ther efore, evaluate design sufficiently.
21/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 (unit : mm) ucsp30l1 (brca016gwz-w) ba 0.05 1pin mark 3 0.250.05 6- 0.200.05 1.300.05 21 0.1850.05 b 0.770.05 a 0.4 p=0.42 b a s 0.06 s 0.35max 0.080.05 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin part numbering b r c a 01 6 gwz - w e 2 part number package gwz: ucsp30l1(brca016gwz-w) packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram ucsp30l1 (brca016gwz-w) ucsp30l1 (brca016gwz-w) (top view) ab3 part number marking lot number 1pin mark
22/22 datasheet datasheet brca016gwz-w (16kbit) ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 25.feb.2013 rev.002 tsz02201-0r2r0g100510-1-2 revision history date revision changes 5.sep.2012 001 new release 25.feb.2013 002 update some english words, sentences? descriptions, grammar and formatting. update figure 35. wp valid timing.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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